Senior Technical Program Manager - Packaging Development
Company: Intel
Location: Hillsboro
Posted on: May 8, 2024
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Job Description:
Job Details:Job Description: -Intel Silicon Photonics Product
Division (SPPD) is at the forefront of silicon photonics
integration and is at the heart of Intel's transformation from a PC
company to a company that powers the cloud and billions of smart,
connected computing-devices. Since announcing the world's first
hybrid silicon laser nearly a decade ago, our team continues to
lead the industry with cutting-edge technology and efficient,
scalable high-volume manufacturing. Our dedication to advanced
development ensures that Intel Silicon Photonics continues to drive
future data center bandwidth growth with smaller form factors,
co-packaging and higher speeds from 800G today to 1.6T+ and beyond
tomorrow. We are looking for great talent to accelerate this
journey so if you are interested in joining our leading
organization then we want to hear from you.We are seeking a
seasoned execution leader to help drive advanced packaging
development and commercialization of our cutting-edge optical
interconnect products, which are set to revolutionize data center
connectivity and XPU I/O. These innovative products are designed to
achieve exceptionally high bandwidth density and energy efficiency,
necessitating breakthroughs in design, photonic and electrical
integrated circuits, engine packaging, testing, and production
processes. As a pivotal figure within our interdisciplinary team,
your responsibilities will include but not limited to:Orchestrating
a collaborative, cross-functional team spanning various divisions
within a vast organization to establish and articulate a definitive
Plan of Record (POR).Coordinating the interplay and cohesive
integration of multiple projects, teams, and
stakeholders.Navigating through uncertainty, seizing opportunities,
and instilling decision-making frameworks to evaluate and
prioritize a range of strategic and operational choices, ensuring
resolution of issues with an unwavering commitment to
quality.Guiding program strategies by assessing and reconciling the
technical requirements against the business implications of project
and program decisions, all while operating within established
parametersSpecific job responsibilities include but not limited
to:Oversees and guides the Photonic ICs (PICs), Electronic ICs
(EICs) and/or packaging development efforts from project initiation
through initial production ramp.Charting the course for our segment
of groundbreaking new product platforms, collaborating with
external divisions to define and deliver strategic technical
program outcomes, and effectively communicating these
developments.Creating program level timeline to understand work
stream dependencies and sequencing.Clearly communicates
expectations for work output and completion dates to technical team
members and partners.Serving as the liaison among various teams,
including fabrication, Optical design, Hardware design, Firmware,
IC, Test, Operations, and Quality, to facilitate product
development and support high-volume manufacturing (HVM)
ramp-up.Orchestrating alternative design strategies as a
contingency for designs with high risk.Monitoring and reporting on
budget allocations and weekly progress toward development
milestones.Providing motivation and encouragement to team members
to achieve project milestones.Fostering strong, positive working
relationships with all product stakeholders through prompt
responses, transparent communication, and by addressing their
specific product development needs at any given time.Collaborating
with stakeholders to ensure manufacturing readiness across
fabrication, assembly, and testing facilities, which includes
managing engineering sample production, wafer start planning,
product qualification strategy, capacity analysis, and
certification of assembly and test sites.Qualifications:Minimum
qualifications are required to be initially considered for this
position. Preferred qualifications are in addition to the minimum
requirements and are considered a plus factor in identifying top
candidates.Minimum Qualifications:The candidate must possess a
Bachelor's degree in Physics, Electrical Engineering or related
discipline with 6+ years of STEM experience3+ years of experience
in at least one of the following:End to end High-Speed Optical
component/product development, Silicon fab or Wafer level assembly
process developmentPreferred Qualifications:Master's degree with 6+
years of experience in Physics, Electrical Engineering or related
discipline.3+ years of experience working on fab process
development.3+ years of experience in program management.3+ years
of experience in Wafer Level assembly process developmentFor
information on Intel's immigration sponsorship guidelines, please
see Intel U.S. Immigration Sponsorship Information.Job
Type:Experienced HireShift:Shift 1 (United States of
America)Primary Location: -US, California, Santa ClaraAdditional
Locations:US, Arizona, Phoenix, US, California, Folsom, US, New
Mexico, Albuquerque, US, Oregon, HillsboroBusiness group:Corporate
Strategy Office is chartered to support the executive office in
driving corporate initiatives, including near and long-term
strategy, major cross-group decision making and ensuring
cross-company alignment. - To deliver to that mission, the team
owns shaping, driving and synthesizing insights to directionally
orient trends as well as long range strategic planning/visioning ,
cross company alignment and greenfield innovation. - Communications
are essential to drive alignment so there is a focus on
communications, community and acumen development. - The team is
ccommitted to ensuring that Intel efforts are aligned to, and
actively driving success toward the most impactful business
strategies.Posting Statement:All qualified applicants will receive
consideration for employment without regard to race, color,
religion, religious creed, sex, national origin, ancestry, age,
physical or mental disability, medical condition, genetic
information, military and veteran status, marital status,
pregnancy, gender, gender expression, gender identity, sexual
orientation, or any other characteristic protected by local law,
regulation, or ordinance.Position of TrustN/ABenefits:We offer a
total compensation package that ranks among the best in the
industry. It consists of competitive pay, stock, bonuses, as well
as, benefit programs which include health, retirement, and
vacation. -Find more information about all of our Amazing Benefits
here: -Annual Salary Range for jobs which could be performed in US,
California:$123,139.00-$203,801.00Salary -range -dependent on a
number of factors including location and experience.Work Model for
this RoleThis role will be eligible for our hybrid work model which
allows employees to split their time between working on-site at
their assigned Intel site and off-site. In certain circumstances
the work model may change to accommodate business
needs.SummaryLocation: US, California, Santa Clara; US, Oregon,
Hillsboro; US, New Mexico, Albuquerque; US, California, Folsom; US,
Arizona, PhoenixType: Full time
Keywords: Intel, Tigard , Senior Technical Program Manager - Packaging Development, Executive , Hillsboro, Oregon
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